Halnziye Thermal Glue HY910 10g

Description: Thermal Conductive Glue, High-Performance Thermal Plaster, Silicone Viscous Adhesive Cooling Compound, Heatsink Glue for LED GPU MOSFET 3D Printer IC Chipset High Thermal Conductivity - With a thermal conductivity rate of 0.975W/m-K, this thermal conductive glue helps disperse heat effectively from MOSFETs, LEDs, ICs, GPU chipsets, and other electronic components that require direct bonding. It is suitable for all heatsinks without a fixed clip, and can be used for a wide range of applications. Safe and Non-Electrical Conductive - This thermal adhesive is non-electrical conductive, safe, and non-toxic, making it safe for both users and electronic components. It is odorless, moisture-resistant, and non-swelling, ensuring that it does not damage the substrate over time. Important: it is important to note that this thermal glue should not be used between the CPU and heatsink. Strong Adhesion - This thermal plaster features strong adhesion properties that allow it to bond with most metals and non-metals, ensuring a reliable and long-lasting connection. The adhesion and tensile strength is 2.1（MPA）, making it a high-performance option that delivers excellent results. Quick Drying Time - This thermal adhesive cures quickly upon contact with air, with a drying time of approximately 30 minutes at 25℃. This makes it easy and convenient to apply, with minimal downtime required. Wide Service Temperature Range - With a service temperature range of -60~250 degrees Celsius, this thermal adhesive is suitable for use in a wide range of industries and applications. It has good thermal conductivity and stability, and is ideal for use in electrical appliances, instruments, and other industries that require effective heat dissipation.

Price: 4.99 USD

Location: West Lafayette, Indiana

End Time: 2024-11-14T22:29:49.000Z

Shipping Cost: N/A USD